Tag Archives: TD-HSPA

Spreadtrum tapes out 40-nm LP chip using Cadence Silicon Realization

Posted on January 21, 2011 by mtlin

PARIS – Subject to time-to-market factors, Spreadtrum Communications Ltd. (Shanghai, China) has adopted Cadence’s Silicon Realization products for the design of a 40-nm low power TD-HSPA/TD-SCDMA multi-mode communication baseband processor. The chip was taped out with one-pass silicon success and … Continue reading →

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2011 年，展訊的三顆子彈

Posted on January 21, 2011 by mtlin

無疑，2010 年成為自展訊誕生以來最輝煌的一年，不僅在 GSM 市場拿下 20% 的市場份額，銷售額估計也將達到 3.4 ~ 3.5 億美元新高，當然股票價格也超越了 20 美元，在納斯達克的半導體公司中站到中上游位置。然而，輝煌的 2010 年過去後，昌旭聽到很多業界人士都在問：幾乎憑著一個 6600L 打天下的展訊，後勁在哪裡？2011 年如果重要對手 MTK 恢復元氣展訊如何應對？再者，面對新入者台灣小 M 加入，展訊在 2011 年的份額會受到影響嗎？

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Spreadtrum Announces the World’s First Commercial 40nm Low Power TD-HSPA /TD-SCDMA Multi-mode Communication Baseband Processor

Posted on January 18, 2011 by mtlin

BEIJING, Jan. 18, 2011 — Spreadtrum Communications, Inc. (Nasdaq: SPRD; “Spreadtrum” or the “Company”), a leading fabless semiconductor provider in China with advanced technology in both 2G and 3G wireless communications standards, today announced the world’s first 40nm low power … Continue reading →

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