Tag Archives: P.A. Semi

Analyst: Infineon exits cell IC market just in time

SAN JOSE, Calif. – Intel Corp. plans to purchase Infineon Technologies AG‘s Wireless Solutions Business (WLS) for $1.4 billion in cash with the deal expected to close in the first quarter of 2011. This is yet another deal in a … Continue reading

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蘋果將自行為 iPhone 研發晶片?

據紐約時報(New York Times)報導(原文:New iPhone Chip Will Cost an ARM and a Missile),蘋果(Apple)的資深晶片研發團隊經理 Wei-han Lien 之前在商務社交網站 LinkedIn 描述自己的工作內容時,提到他正忙於為下一代 iPhone 研發 ARM 晶片。 此項消息在曝光後,便引來各界注目,因此,另據 The Register 網站報導指出,Lien 在該網站的檔案已經默默消失。 In a recent update to his profile on Linked-In, Wei-han Lien, previously an engineer … Continue reading

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