Tag Archives: low power

TI buys National Semiconductor for $6.5B

TI will combine its 30,000 analog products and advanced manufacturing capabilities with National’s offerings IDG News Service – Texas Instruments announced on Monday that it has agreed to acquire National Semiconductor for $6.5 billion in an all-cash transaction. TI, which … Continue reading

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Spreadtrum tapes out 40-nm LP chip using Cadence Silicon Realization

PARIS – Subject to time-to-market factors, Spreadtrum Communications Ltd. (Shanghai, China) has adopted Cadence’s Silicon Realization products for the design of a 40-nm low power TD-HSPA/TD-SCDMA multi-mode communication baseband processor. The chip was taped out with one-pass silicon success and … Continue reading

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Spreadtrum Announces the World’s First Commercial 40nm Low Power TD-HSPA /TD-SCDMA Multi-mode Communication Baseband Processor

BEIJING, Jan. 18, 2011 — Spreadtrum Communications, Inc. (Nasdaq: SPRD; “Spreadtrum” or the “Company”), a leading fabless semiconductor provider in China with advanced technology in both 2G and 3G wireless communications standards, today announced the world’s first 40nm low power … Continue reading

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蘋果將自行為 iPhone 研發晶片?

據紐約時報(New York Times)報導(原文:New iPhone Chip Will Cost an ARM and a Missile),蘋果(Apple)的資深晶片研發團隊經理 Wei-han Lien 之前在商務社交網站 LinkedIn 描述自己的工作內容時,提到他正忙於為下一代 iPhone 研發 ARM 晶片。 此項消息在曝光後,便引來各界注目,因此,另據 The Register 網站報導指出,Lien 在該網站的檔案已經默默消失。 In a recent update to his profile on Linked-In, Wei-han Lien, previously an engineer … Continue reading

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