Tag Archives: 55nm

RDA Microelectronics Sampling Wi-Fi Combo Chip

Posted on December 19, 2011 by mtlin

3-in-1 Connectivity Chip Designed to Support 3G/4G Smartphone Growth SHANGHAI, China, Dec. 19, 2011 (GLOBE NEWSWIRE) — RDA Microelectronics (Nasdaq:RDA) (“RDA Microelectronics” or the “Company”), a fabless semiconductor company that designs, develops and markets Radio Frequency (RF) and mixed-signal chips … Continue reading →

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