Tag Archives: 40nm

Icera aims Espresso at smartphones

Posted on January 27, 2011 by mtlin

LONDON – Fabless chip company Icera Inc. has announced it is sampling the latest chip set and software in its Espresso series of platforms targeted at HSPA+ smartphones. (See: Icera Announces World’s Smallest HSPA+ Voice and Data Platform for Android™ … Continue reading →

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展訊 40 奈米　槓聯發科

Posted on January 21, 2011 by mtlin

IC 設計龍頭廠聯發科（2454）在中國大陸 2G 手機晶片市場頭號競爭對手展訊，今年展現強化布局 3G 晶片 TD-SCDMA 的企圖心，已推出價格更具競爭力的 TD 多模、低功耗晶片，與聯發科搶食中國移動今年 3,000 萬套 TD 手機採購商機。 展訊日前在中國大陸舉辦全球首款 40 奈米 TD 晶片發布會，展訊董事長兼執行長李力游親自出席，代表展訊宣布將推出全球第一款 40 奈米低功耗商用 TD-HSPA／TD-SCDMA 多模手機晶片「SC8800G」。 與聯發科目前主要採用 65 奈米製程相較，展訊成為繼高通後，跨入 40 奈米製程的手機晶片廠。李力游指出，3G 手機功耗非常重要，功耗愈高，手機待機能力愈差，因此 40 奈米的 TD 多模基頻晶片可以實現 TD 多模手機功耗大大降低，有利手機廠商開發具有市場競爭力的低功耗 TD 手機。 李力游認為，40 奈米的 TD … Continue reading →

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Spreadtrum tapes out 40-nm LP chip using Cadence Silicon Realization

Posted on January 21, 2011 by mtlin

PARIS – Subject to time-to-market factors, Spreadtrum Communications Ltd. (Shanghai, China) has adopted Cadence’s Silicon Realization products for the design of a 40-nm low power TD-HSPA/TD-SCDMA multi-mode communication baseband processor. The chip was taped out with one-pass silicon success and … Continue reading →

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2011 年，展訊的三顆子彈

Posted on January 21, 2011 by mtlin

無疑，2010 年成為自展訊誕生以來最輝煌的一年，不僅在 GSM 市場拿下 20% 的市場份額，銷售額估計也將達到 3.4 ~ 3.5 億美元新高，當然股票價格也超越了 20 美元，在納斯達克的半導體公司中站到中上游位置。然而，輝煌的 2010 年過去後，昌旭聽到很多業界人士都在問：幾乎憑著一個 6600L 打天下的展訊，後勁在哪裡？2011 年如果重要對手 MTK 恢復元氣展訊如何應對？再者，面對新入者台灣小 M 加入，展訊在 2011 年的份額會受到影響嗎？

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Spreadtrum Announces the World’s First Commercial 40nm Low Power TD-HSPA /TD-SCDMA Multi-mode Communication Baseband Processor

Posted on January 18, 2011 by mtlin

BEIJING, Jan. 18, 2011 — Spreadtrum Communications, Inc. (Nasdaq: SPRD; “Spreadtrum” or the “Company”), a leading fabless semiconductor provider in China with advanced technology in both 2G and 3G wireless communications standards, today announced the world’s first 40nm low power … Continue reading →

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