LONDON – Fabless chip company Icera Inc. has announced it is sampling the latest chip set and software in its Espresso series of platforms targeted at HSPA+ smartphones. (See: Icera Announces World’s Smallest HSPA+ Voice and Data Platform for Android™ Smartphones)
The Espresso 450 comprises Icera‘s latest baseband and RF ICs and delivers quad band HSPA+ up to 28-Mbps together with full quad band 2G/3G voice support functions in a packaged footprint of 700 square millimeters. Espresso 450 includes a radio interface layer for the Android operating system.
“Icera has evolved quickly from its start-up phase to being established now as one of only two major vendors in the data-intensive mobile broadband chipset market, with Icera being famous for continuously offering the world’s highest performing chipsets,” said Stan Boland, president and CEO of Icera (Bristol, England), in a statement.
Espresso 450 uses the ICE9225 multi-mode transceiver chip and the Livanto ICE8065 soft baseband processor. The ICE9225 radio is implemented in low power 65-nm CMOS technology. The ICE8065 is implemented in 40-nm CMOS and is the soft baseband that runs all of the modem physical layer, protocol stack, voice codecs, echo cancellation, noise reduction and equalization in software.
Icera is engaged with leading application processor partners on pre-integration of the Espresso 450 platform with the latest application processor platforms to accelerate the fast design of complete smartphones. Samples of first phones using Espresso 450 are expected to ship late in 2011.
Peter Clarke / EETimes