英特爾全球第八座 12 吋廠落腳大連

好事多磨!英特爾全球第八座 12 吋廠落腳大連
斥資 25 億美元、命名 Fab 68 大陸晶圓代工廠樂觀以對

英特爾Intel)執行長 Paul Otellini 於 26 日與大陸官方共同召開「芯心相印」12 吋晶圓廠落腳大陸簽約儀式暨記者會,Otellini 正式宣布大連新廠將命名 Fab 68,這是英特爾睽違 15 年後再度在全新地點建造新廠,亦是英特爾全球所布局第八座 12 吋廠,預計英特爾大連廠將投資 25 億美元,並招募 1,500 名員工。

Otellini 在致詞中表示,大陸是英特爾全球成長最快的市場,在該市場加大投資,以達成就近服務客戶的願望,至於英特爾大連 12 吋晶圓廠命名 Fab 68,係因 6 與 8 在中國習俗都是吉利數字,意味著發展與繁榮,英特爾亦想藉此前進大陸並發展繁榮。

英特爾共耗時 5 年評估是否設廠於大陸,光是與大陸當局來回協商,以及向美國申請授權,就經歷了 2 年,期間包括以色列、印度等多國城市,均加入角逐蓋晶圓廠行列,最後終於由大連出線。英特爾發言人 Chuck Mulloy 則指出,目前大連廠僅獲得英特爾 90 奈米製程技術授權,升級需進一步授權審核。

大陸國家發展與改革委員會副主任張曉強表示,英特爾投資建晶圓廠計畫正式進入啟動階段,該晶圓廠為近幾年來大陸與美國間最大合作計畫,將進一步鞏固英特爾全球半導體核心地位,英特爾亦承諾將為大陸培訓更多人才,促進相關產業發展。儘管英特爾登陸設 12 吋廠是否符合經濟效益眾說紛紜,但業界多認為大陸肯定給予英特爾優渥的設廠條件。

事實上,英特爾此舉不僅象徵其製造策略轉變,亦凸顯其看好大陸市場、不惜加碼一搏的決心。位居大陸東北沿海的大連,一直是大陸積極對外資新產業招商的重點城市,為符合美國對技術出口政策規定,英特爾將大連廠定位為晶片組生產線,而非從事核心產品微處理器製造,自然無最尖端製程技術外洩之虞。

目前英特爾在美國本土、愛爾蘭及以色列等地都設有晶圓廠,在大連廠拍板定案前,該公司已連續 15 年之久未在全新地點設立晶圓廠,不過,英特爾早已在大陸成都與上海設有 2 座封裝測試廠。Mercury Research 分析師指出,在任何新地點從事晶圓製造,涉及風險頗大,包括尋覓足夠生產線人手,純水來源與電力供應都是燃眉之急。

值得注意的是,Otellini 26 日選擇在大陸「人民大會堂」舉辦記者會,背後涵意頗令人玩味,由於許多大陸客戶都與官方有淵源,因此,未來英特爾與客戶協商時,可望比勁敵超微AMD)更具銷售優勢。此外,英特爾還可藉此增強對大陸官員在議題協商的影響力,例如晶片設計等保護智慧財產權相關問題。

針對英特爾宣布大連投資案,大陸最大晶圓代工廠中芯國際樂觀以對。中芯國際表示,英特爾選擇大連投資 12 吋廠,證明大陸吸引外商前來投資氛圍持續具有極強吸引力,事實上,已有許多國外半導體業者紛前來大陸投資,設立製造及研發據點,以提升其在大陸市場能見度,並抓住絕佳商機,而這樣的趨勢對於大陸高科技長遠發展,具有絕對的助益,將讓大陸半導體產業供應鏈逐漸走向健全發展。

目前中芯國際製程已經可達 90 奈米,65 奈米製程則在積極研發中,對於台灣晶圓廠來說,儘管英特爾赴大陸設廠與台系晶圓廠所主攻市場不同,但卻有十足警示作用。台積電董事長張忠謀日前便曾公開指出,英特爾在大陸先進製程為 90 奈米,2 年後將進入 65 奈米製程 ,然台廠仍受限法令僅開放成熟製程登陸,未來台積電在大陸恐將遠遠落後英特爾

Intel 全球 12 吋晶圓廠一覽

電子時報(記者宋丁儀、國際新聞中心蔡綺芝/台北) 2007/03/27

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延伸閱讀:US may back down on tech export policy

SHANGHAI — The U.S. government is taking a second look at a controversial plan to tighten export controls on technology shipped to China and is indicating that it may back down a bit to mollify fears that U.S. high-tech gear bound for one of the world’s fastest-growing economies will become mired in a tangle of red tape that encourages buyers to shop elsewhere.

US may back down on tech export policyThe changes, championed by the Bush administration, were scheduled to fall into place as early as April and are intended to cast a wider net over commercial technology products that might make a “material contribution” to the advancement of China’s military.

The technology industry has blasted the plan, and deluged the administration with more than 1000 pages of feedback during a six month public comment period that ended in December.

Speaking at Semicon China Friday, a U.S. Department of Commerce official said his agency is revising the proposed rule and believes it can be published within a few months in the U.S. Federal Register. “It was one of the rules that caused the most stir,” said Alex Lopes, an official at DoC’s Bureau of Industry and Security. “The department is working feverishly to address those comments.”

At its core, the rule seeks to expand the category of items that are “dual use” — products that have both commercial and military applications. The proposal unnerves many companies because it sets the bar low enough to expose a much wider variety of products to the export-licensing process, including goods that are readily available from foreign competitors.

It also puts a higher burden of liability on companies to determine whether the item will be used for military purposes.

Lopes said Commerce is reviewing the new items that fall under the proposal in its current form, and is “attempting to make that list more appropriate.”

He also said there was a lot of concern about how much due diligence a US vendor would need to do to determine if the end use was for the military. This portion of the proposal will also be revised, he said.

By Mike Clendenin
EE Times
(03/23/07, 00:29:00 H EDT)

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台灣政府是在豬頭什麼?人家美國都沒在怕了,而你們卻還在審 .18 製程可不可以去大陸… 可以看得出來台灣的前途真的是黯淡無光……

歷史上的今天

About mtlin

I'm easygoing and sometimes sentimental, also can be very funny. Geek style but social. A Blogger, a Wikipedian and an Engineer.
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